Title: Power Grid Physics and Implications for CAD
Dr. Eli Chiprout
From the Strategic CAD Labs, Intel Corp., USA
Much research has been done lately concerning analysis and optimization techniques for on-chip power grid networks. However, all of these approaches assume a particular model or behavior of the power delivery.
In this paper, we describe the first detailed full-die dynamic model of an industrial microprocessor design, including package and non-uniform decap distribution. This model is justified from the ground up using a full-wave model and then increasingly larger but less detailed models with only the irrelevant elements removed. Using these models we show that there is little impact of on-die inductance in such a design, and that the package is critical to understanding resonant properties of the grid.
We also show that transient effects are sensitive to non-uniform de-cap distribution and that locality is a tight function of frequency and of the package-die resonance, producing newly explained localized resonant effects. Specifically, all of these points have impact on what kind of analysis and optimization are required from CAD.
After partial studies in medicine and liberal arts, Dr. Chiprout receive his B.Eng. in Electrical engineering at McGill University, Montreal, Canada in 1988. Following a period of industry experience in IBM Canada, Northern Telecom and Mitel Semiconductor, he completed a Ph.D. in electrical engineering at Carleton University, Ottawa, Canada where he received the university medal for outstanding graduate work. Following his studies, worked at IBM's research division, both at the T.J. Watson research center and the Austin research lab, specializing in high-speed circuit simulation, interconnect modeling and operating system research for a Non-Uniform Memory Architecture (NUMA) multi-node system. He joined Intel in Jan. 2000 where he has focused on advanced CAD issues for microprocessor design such as power grid analysis, clock modeling and inductance. He joined Strategic CAD labs in Jan. 2002 where he continues his research.
Dr. Chiprout is the co-author of a book by Kluwer Press, has applied for and received U.S. patents, as well as being the author of numerous journal and conference articles. He has presented several invited talks including at the Institute for Mathematics and its Applications at the University of Minnesota, International Electron Devices Meeting (IEDM), Bipolar/BiCMOS circuits and technology meeting (BCTM), as well as other conferences. He also enjoys reading, swimming, hiking and spending time with family and friends.