Financially Sponsored


Electronic Design Process Symposium (2019)

Date & Time

Thu, Sep 26th, 2019 to Fri, Sep 27th, 2019

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Milpitas, CA

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The 2019 Electronic Design Process Symposium is the leading forum for 
advanced chip and systems development, and CAD methodologies.

Recent advances in computational power, data science technology, and 
associated applications have led to the development and proliferation of 
machine learning, intelligent manufacturing, and predictive design 
methodologies. New techniques are also emerging to enable reduced NRE 
and faster time to market, which are critical components in any 
semiconductor business.

In this annual gathering of electronic IC/system designers, developers, 
and manufacturing experts, we will discuss design methodologies, design 
flows and CAD tool needs via keynotes, presentations, and panel 
discussions. Contributors will choose from topics such as Machine 
Learning in System Design and EDA, Smart Manufacturing, Innovative 
Designs and Design Techniques, System Synthesis, Smart Verification, 
System Reliability, and Cyber Systems Design with an emphasis on security.

Please contact Ramond Rodríguez ([email protected]) to submit 
IEEE-EDPS 2019 abstracts and discuss mutual areas of interest.  All presentation slides must be made available in final form by Aug 15, 2019.

Complete presentations from 2018 EDPS and prior years are available at:


39.1756914, -96.6076021


Milpitas, CA