Christopher Bailey Electronics Packaging University of Greenwich IEEE Region: 8 Email Website Biography CHRIS BAILEY (A’01, M’03, SM’05) is a Professor of Computational Mechanics and Reliability at the University of Greenwich, London, United Kingdom. I received my PhD in Computational Modelling from Thames Polytechnic in 1988, and an MBA in Technology Management from the Open University in 1996. Before joining Greenwich in 1991, I worked for three years at Carnegie Mellon University (USA) as a research fellow in materials engineering. One of my main achievements with regard to CPMT was helping to establish the Region 8 flagship conference ESTC (Electronics System-integration Technology Conference). I was the Programme Chair for the first conference held in Dresden and was the General Chair for the 2008 conference in London. In 2007 I was the local chair for the IEEE EPS sponsored EuroSime conference held in London, and since 2009 have worked with the EuroSime team as co-editor of the proceedings and track chair for multi-physics modelling. Since 2010 I have had the pleasure of serving you as a member of the CPMT Board of Governors. During my first term on the BoG, I also took on the role of Strategic Director for Student Programs with the aim of supporting students involved in CPMT activities worldwide. Particular achievements include arranging financial support for student attendees at the International Spring Seminar on Electronics Technology (ISSE) as well as promoting student membership at events such as ECTC, EPTC, and ESTC. Other CPMT activities that I have been involved with include membership of technical committees for EPTC (Singapore), Eurosime (Europe), ISSE (Europe) and ICEP/HDP (China) where I am a regular attendee and presenter. I have also worked closely with others in Europe to help promote closer co-operation between CPMT and IMAPS for the benefit of the whole community. My research has resulted in over 250 publications. I am currently an Associate Editor for the CPMT Transactions and have been a guest editor on the journal of Soldering and Surface Mount Technology. I am also a committee member of the Innovative Electronics Manufacturing Research Centre (IeMRC) in the UK and have participated in a number of UK Government-sponsored overseas missions to promote collaboration and review electronic packaging technologies. Recently I became a member of the working group writing a new IEEE standard for Prognostics and Health Management for Electronic Systems.