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Impact Factor
2
Eigenfactor® Score
0.00119
Article Influence® Score
0.56
CiteScore
3.6
Scope

IEEE Design&Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and round-table discussions.

Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.

IEEE Design&Test offers original works describing the methods used to design and test electronic product hardware and supportive software. The magazine focuses on current and near-future practice and includes tutorials, how-to articles, and real-world case studies. Topics include IC/module design, low-power design, electronic design automation, design/test verification, practical technology, and standards.

IEEE Design&Test is cosponsored with the IEEE Council on Electronic Design and Automation, IEEE Circuits and Systems Society, and the IEEE Solid-State Circuits Society.

Description

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Abstracting is permitted with credit to the source. Libraries are permitted to photocopy for private use of patrons, provided the per-copy fee indicated in the code at the bottom of the first page is paid through the Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923.

Submission Information
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Editorial
Unless otherwise stated, bylined articles and columns, as well as product and service descriptions, reflect the author’s or firm’s opinion. Inclusion in IEEE Design&Test does not necessarily constitute endorsement by IEEE. All submissions are subject to editing for style, clarity, and length.

Subscription Rates
Society members included with membership dues. Subscription rates available upon request.

Copyright and Reprint Permissions
Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limits of U.S. Copyright law for the private use of patrons 1) those post-1977 articles that carry a code at the bottom of the first page, provided the per-copy fee indicated in the code is paid through the Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923 USA; 2) pre-1978 articles without fees.

For other copying, reprint, or republication permission, write Copyrights and Permissions Department, IEEE Operations Center, 445 Hoes Lane, Piscataway, NJ 08854 USA. Copyright 2013 by the Institute of Electrical and Electronics Engineers, Inc. All rights reserved. Periodicals postage paid at New York, NY, and at additional mailing offices.

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Send address changes to IEEE Design&Test, IEEE Operations Center, 445 Hoes Lane, Piscataway, NJ 08854 USA. Canadian GST #125634188. Send undelivered copies and address changes to IEEE Design&Test, Circulation Dept., PO Box 3014, Los Alamitos, CA 90720-1314. Periodicals postage paid at New York, NY, and at additional mailing offices. Canadian GST#125634188. Canada Post Corp. (Canadian distribution) Publications Mail Agreement #40013885. Return undeliverable Canadian addresses to 4960-2 Walker Road; Windsor, ON N9A 6J3.


D&T Co-Sponsors

Memories

  • Country
    NLD
    Affiliation
    Delft University of Technology
    IEEE Region
    Region 08 (Africa, Europe, Middle East)
  • Country
    CHE
    Affiliation
    IBM Research - Zurich
    IEEE Region
    Region 08 (Africa, Europe, Middle East)

ML for EDA

  • Country
    USA
    Affiliation
    Washington State University
  • Country
    ARE
    Affiliation
    New York University Abu Dhabi
    IEEE Region
    Region 08 (Africa, Europe, Middle East)
  • Country
    CYP
    Affiliation
    University of Cyprus
    IEEE Region
    Region 08 (Africa, Europe, Middle East)

Multicores

  • Country
    USA
    Affiliation
    University of Wisconsin-Madison
  • Country
    HKG
    Affiliation
    City University of Hong Kong,
    IEEE Region
    Region 10 (Asia and Pacific)

Perspectives

  • Country
    DEU
    Affiliation
    Karlsruhe Institute of Technology
    IEEE Region
    Region 08 (Africa, Europe, Middle East)

Publicity

  • Country
    USA
    Affiliation
    Washington State University Pullman
    IEEE Region
    Region 06 (Western U.S.)

Reports

  • Country
    ITA
    Affiliation
    Politecnico di Torino
    IEEE Region
    Region 08 (Africa, Europe, Middle East)
  • Country
    FRA
    Affiliation
    Inria Rennes
    IEEE Region
    Region 08 (Africa, Europe, Middle East)

SoC & 3D

  • Country
    TWN
    Affiliation
    National Central University
    IEEE Region
    Region 10 (Asia and Pacific)

Steering Committee Member

  • Country
    ITA
    Affiliation
    Politecnico di Torino
    IEEE Region
    Region 08 (Africa, Europe, Middle East)
  • Country
    PRT
    Affiliation
    INESC-ID, IST, Universidade de Lisboa
    IEEE Region
    Region 08 (Africa, Europe, Middle East)
  • Country
    USA
    Affiliation
    Synopsys, Inc.
    IEEE Region
    Region 10 (Asia and Pacific)

Tutorials

  • Country
    USA
    Affiliation
    University of Florida
    IEEE Region
    Region 03 (Southeastern U.S.)

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