Sandeep Kumar Goel is an academician and Senior Director with Taiwan Semiconductor Manufacturing Company (TSMC), San Jose, CA. He received his M.Tech. degree in VLSI from IIT Delhi in 1999 and his Ph.D. in electrical and computer engineering from the University of Twente in 2005. Prior to joining TSMC, Dr. Goel held various research and management positions at LSI Corporation (California), Magma Design Automation (California), and Philips Research (The Netherlands).

He has co-authored two books, three book chapters, and published over 100 papers in journals and conference/workshop proceedings. Additionally, he has delivered several invited talks and served as a panelist at numerous conferences. Dr. Goel holds more than 100 granted U.S. patents and has several others pending.

He was the recipient of the Most Significant Paper Award at the IEEE International Test Conference in 2010, and the IEEE Computer Society Distinguished Contributor Award in 2022. He served as the General Chair of the 3D Workshop at DATE 2012, the Vice-Program Chair for ITC 2025, and is currently the Program Chair for ITC 2026.

Dr. Goel is a Fellow of the IEEE and chairs the IEEE Std. P3537 Standard for 3Dblox: Chiplet connectivity and physical properties description language. His current research interests include all topics in the domain of testing, diagnosis, and failure analysis of 2D and 3D chips.