Acronym
ACCESS 2022
2022 International Symposium on 3D IC and Heterogeneous Integration
Date
–
Event Menu
Description
Date: 26 - 28 April 2022 (HKT, UTC+8)
Registration
Venue: Zoom
Free Registration: https://forms.office.com/Pages/ResponsePage.aspx?id=4vMXySKTJkmbs9rKcwQ…
Technical Program Committee
Members:
Prof. Tim Cheng, The Hong Kong University of Science and Technology
Prof. Lance Li, The University of Hong Kong
Prof. Ricky Lee, The Hong Kong University of Science and Technology
Secretariat: Dr. Jeffery Lo, The Hong Kong University of Science and Technology ((Click to show email))