Dr. Rajiv V. Joshi is a research staff member and key technical lead at T. J. Watson research center, IBM. He received his B.Tech I.I.T (Bombay, India), M.S (M.I.T) and Dr. Eng. Sc. (Columbia University). His novel interconnects processes and structures for aluminum, tungsten and copper technologies which are widely used globally in various technologies from sub-0.5µm to 5nm.  He has led successfully predictive failure analytic techniques for yield prediction and the technology-driven SRAM at IBM Server Group. His statistical techniques are tailored for machine learning and AI.

He commercialized these techniques. He developed novel memory designs in SRAMS, DRAMS, TRAMS, MRAMs which are used in industries.  He received 4, Outstanding Technical Achievement (OTAs), 3 highest Corporate Patent Portfolio awards for licensing contributions, holds 69 invention plateaus, issued to his name over 250 US and over 400 including international patents. Many of his patents are related to PVD, CVD metal deposition techniques which have impacted over billions of dollars.

His interests are in in-memory computation, CNN, DNN accelerators and Quantum computing.  He has authored and co-authored over 210 papers.

Other Notable Awards and Activities

He has given over 50 invited/keynote talks and given several Seminars.
NY IP Law association awarded him as the “Inventor of the year” in Feb 2020.
He received the prestigious IEEE Daniel Noble award in 2018.
Also, he is the recipient of the Best Editor Award from IEEE TVLSI journal and the 2015 BMM award.
He is inducted into New Jersey Inventor Hall of Fame in Aug 2014 along with pioneer Nicola Tesla.
He is a recipient of 2013 IEEE CAS Industrial Pioneer award and 2013 Mehboob Khan Award from Semiconductor Research Corporation.
He was given the same award again in 2020 for AI initiatives in BRIC program funded by SRC.
He won several best paper awards from ISSCC 1992, ICCAD 2012, ISQED, VMIC.
He is a member of IBM Academy of technology and a master inventor.
He served as a Distinguished Lecturer for IEEE CAS and EDS society.
He is currently a Distinguished Lecturer for CEDA.
He is an IEEE, ISQED and World Technology Network fellow and distinguished alumnus of IIT Bombay.
He serves in the Board of Governors for IEEE CAS as an industrial liaison.
He serves as an Associate Editor of TVLSI.
He will and has served on committees of DAC 2019, AICAS 2019, ISCAS, ISLPED (Int. Symposium Low Power Electronic Design), IEEE VLSI design, IEEE CICC, IEEE Int. SOI conference, ISQED and Advanced Metallization Program committees.
He initiated IBM CAS EDS symposium at IBM in 2017 and will continue into 2018 with Artificial Intelligence as the focal area.
He served as a general chair for IEEE ISLPED.
He is an industry liaison for universities as a part of the Semiconductor Research Corporation.
Also he is on the industry liaison committee for IEEE CAS society.