Vasilis Pavlidis
Greece

Vasilis Pavlidis

Affiliation
ECE Dept. at Aristotle University of Thessaloniki (AUTh)
IEEE Region
Region 08 (Africa, Europe, Middle East)
Email

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Vasilis F. Pavlidis received the M.Sc. and Ph.D. degrees from the Department of Electrical and Computer Engineering, University of Rochester, NY, USA, in 2003 and 2008, respectively. From 2008 to 2012, he was a Post-Doctoral Researcher with the Integrated Systems Laboratory, EPFL, Lausanne, Switzerland. Since 2012, he has been an Assistant Professor within the Advanced Processor Technologies Group, School of Computer Science, University of Manchester. His current research interests include the area of interconnect modeling and design, 3-D integration, networks-on-chip, and related design issues in VLSI. He is the co-creator of the Rochester Cube, the Manchester Thermal Analyzer Software, and leading author of the book Three Dimensional Integrated Circuit Design

IEEE CEDA Position History:
  • Present   3D Design & Optimization (Transactions on Computer Aided Design of Integrated Circuits & Systems Editoral Board)
  • 2024-Present   Member (Publications Committee )
  • 2022-Present   Assistant VP Activities (Executive Committee)
  • 2018-2021   Vice President Publicity (Executive Committee)
  • 2018-2021   Chair (Publicity Committee)
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