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About
About Us
About CEDA
Member Societies
Leadership
Executive Committee
Board of Governors
Governing Documents
Constitution & Bylaws
Minutes & Presentations
Publicity
Publicity Resources
YouTube Presentations
Staff
Operations Manager
Awards
Awards & Recognitions Program
About Awards & Recognitions Program
Council Awards
Chapter of the Year
Distinguished Service Award
Ernest S. Kuh Early Career Award
Phil Kaufman Award
Phil Kaufman Hall of Fame
Publications Awards
A. Richard Newton Award
Donald O. Pederson Award
Conference Awards
Outstanding Service Recognition
William J McCalla Award
IEEE Awards
Fellows
Activities
Education
Distinguished Lecturer Program
Virtual Distinguished Lecturer Program
CAD for Assurance
Design Automation Webinars
Chapters
Chapter Listings
Chapter Resources
Students and YP
Students
Student Travel Program
Young Professionals
Diversity, Equity, & Inclusion
About
Women in Technology at DAC
DivEDA at DATE
IEEE WIE
Technical Operations
About Technical Operations
Technical Committees
Conferences
About Conferences
About Conferences
Conference Listing
Event Calendar
Conference Calendar
Publications
About Publications
About Publications
Currents Newsletter
Subscribe to Newsletter
Transactions on Computer-Aided Design of Integrated Circuits & Systems
About TCAD
TCAD's Editorial Corner
Editorial Board
Call for Papers
Instructions for Authors
Current Issue
Donald O. Pederson Award
Embedded Systems Letters
About ESL
Editorial Board
Special Issues
Instructions for Authors
Apply to Become External Reviewer
Current Issue
Co-Sponsored Publications
IEEE Design&Test (D&T)
IEEE Internet of Things Magazine (IoTM)
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits (JxCDC)
IEEE Transactions on Circuits and Systems for Artificial Intelligence (TCASAI)
IEEE Transactions on Signal and Power Integrity (TSPI)
IEEE Transactions on Sustainable Computing (T-SUSC)
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Position
TSPI Editor-in Chief
TSPI Editor-in Chief
Current
Jun Fan
Affiliation
Missouri University of Science and Technology
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