Yiyu Shi

Dr. Yiyu Shi headshot

Yiyu Shi

IEEE Region: 4 (Central U.S.)


Dr. Yiyu Shi is currently an associate professor in the Department of Computer Science and Engineering and Electrical Engineering (concurrent appointment) at the University of Notre Dame, the director of Sustainable Computing Lab (SCL), and the site director of the NSF Industry/University Cooperative Research Center (I/UCRC) on Alternative and Sustainable Intelligent Computing (ASIC).  He was an August-Wilhelm Scheer visiting professor at Technical University of Munich in 2018, and an assistant professor in the Electrical and Computer Engineering Department at Missouri University of Science and Technology between 2010 and 2015, where he was the site co-director of the NSF I/UCRC on Net-Centric Software and Systems.

He received his B.S. degree (with honor) in Electronic Engineering from Tsinghua University, Beijing, China in 2005, the M.S (with honor) and Ph.D. degree in Electrical Engineering from the University of California, Los Angeles in 2007 and 2009 respectively.

His current research interests include hardware intelligence and biomedical applications. In recognition of his research, many of his papers have been nominated for or awarded as the Best Paper in top conferences (DAC'05, ICCAD'07, ICCD'08, ASPDAC'09, DAC'09, ISPD'13, ICCAD'14, ISPD'15, DAC’16, DAC’19, CVPR Workshop’19, CODES+ISSS’19, ASPDAC’20). He was also the recipient of IBM Invention Achievement Award, Japan Society for the Promotion of Science (JSPS) Faculty Invitation Fellowship, Humboldt Research Fellowship, IEEE St. Louis Section Outstanding Educator Award, Academy of Science (St. Louis) Innovation Award, Missouri S&T Faculty Excellence Award, NSF CAREER Award, IEEE Region 5 Outstanding Individual Achievement Award, Air Force Summer Faculty Fellowship, and IEEE Computer Society TC-VLSI Mid-Career Award. He has served on the technical program committee of many international conferences including DAC, ICCAD, DATE, ISPD, ASPDAC and ICCD. He is an executive committee member of ACM SIGDA, a member of IEEE CEDA Publicity Committee, deputy editor-in-chief of IEEE VLSI CAS Newsletter, and an associate editor of IEEE TCAD, IEEE Access, ACM JETC, VLSI Integration, and IEEE TCCCPS Newsletter. 

Positions & Affiliations

University of Notre Dame
United States