IEEE Transactions on Signal and Power Integrity (TSPI)

The IEEE Transactions on Signal and Power Integrity publishes research and application papers addressing all aspects of signal integrity and power integrity of an electronic system and its components including integrated circuits, IC packages, printed circuit boards, cables, connectors, as well as other relevant electronic and microelectronic components, and signal integrity/power integrity co-design.  Advances in theory, algorithms, design approaches and modeling for ensuring the fidelity and performance of digital, analog, and hybrid electronic systems and sub-systems are considered.

The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors, but the reviewers know the identities of the authors. Articles will be screened for plagiarism before acceptance.

Corresponding authors from low-income countries are eligible for waived or reduced open access APCs.