Call for Papers

Special Issue on: "Trends in Embedded Mechatronic Systems for Smart Manufacturing"

Guest Editors:

  • Dr. Muhammad Attique Khan, HITEC University, Argentina
  • Dr. Ammar Armghan, College of Engineering, Department of Electrical Engineering, Jouf University, KSA
  • Dr. Seifedine Kadry, Noroff University College, Norway

As the manufacturing industry evolves, smart manufacturing quickly emerges as one of the most important trends to watch. This trend has been enabled by advances in technology that have allowed it to collect and analyze enormous amounts of data in real-time to make more informed decisions. Smart manufacturing is a method that uses a combination of automation, data exchange, and manufacturing techniques to optimize production output. In this technology, the software that controls production lines, the sensors that monitor equipment or products, and the computers used to manage operations are integrated into a single operational platform via common networks.

Embedded mechatronics is the designing and implementing intelligent, integrated systems. The technology is used to create products, such as automotive engines and automobiles that use embedded monitoring and control systems. It also supports the Internet of Things (IoT) technologies for manufacturing, making them ideal for smart manufacturing environments. It uses information technology, computer technology, communications technology, automation controls, and other advanced technologies to improve the performance of mechanical equipment adapt to modern manufacturing needs. Smart manufacturing is an element of the manufacturing sector that focuses on integrating modern technology into the production processes, such as advanced machinery and information technology. Embedded mechatronics plays a significant role in smart manufacturing, providing high efficiency, safety, and accuracy.

The Mechatronics group applies mechanical and electronic engineering. The areas include robotics, machine planning and programming, computer numerical control machines, and the application of computer vision technology to automate assembly processes. Also, Sensor fusion, control of electrohydraulic actuators, and real-time embedded systems are just a few technologies applied in mechatronics to make products smarter than ever quickly. Industrial applications primarily drive smart manufacturing development. As embedded mechatronics technology has matured in the past decade, smart manufacturing technologies are also becoming increasingly mature. Embedded mechatronics for smart manufacturing lies in its interdisciplinary characteristics and strong capability to implement cyber-physical systems and services. It mainly concerns the seamless integration between control and information technology, which calls for mutual collaboration between control engineers and informatics engineers. The advantages of embedded mechatronics in smart manufacturing are that it can generate more efficient, less cost-intensive, and more reliable products, processes, and production systems and enable higher levels of flexibility. However, embedded mechatronic faces challenges in implementing smart manufacturing technology such as high-frequency communications among non-traditional devices. Furthermore, the solution of various physical effects that contribute to the respective modal behavior and modeling aspects and detection and control approaches of the dynamic behavior with interactive components. Submissions are welcome for articles that examine scientific advice from various academic perspectives, including science and technology studies. Insights from practitioners and case studies are also welcome.

We solicit submissions from the following thematic areas:

  • Impact of Embedded Systems Infrastructure for Smart Manufacturing.
  • Data-centric Manufacturing techniques.
  • Human-Robot Interaction for the supply chain management.
  • Implementation of the Industrial Internet of Things for increased monitoring.
  • Mission Planning and Automation of the Flexible Manufacturing System.
  • Current limiting electronics for human safety and collision avoidance.
  • High-speed control of microelectromechanical systems in the manufacturing environment.
  • Large deformation mechanics and micro-assembly of large structures.
  • Implementation and integration of the embedded mechatronic systems into networked production systems.
  • Advances in Network-on-chip for smart manufacturing.
  • Sensor and signal processing for industrial applications.
  • Model predictive control of manufacturing processes and machines

Notes for Prospective Authors

Submitted papers should not have been previously published nor be currently under consideration for publication elsewhere (N.B. Conference papers may only be submitted if the paper has been completely rewritten, appropriate written permissions have been obtained from any copyright holders of the original paper, and the paper has been extended conceptually by at least 30%.).

All papers are refereed through a peer review process.

All papers must be limited to 4 pages written in English. Accepted papers will be required to submit a 3-minute Video Preview, introducing and motivating the paper. For more information, please read the IEEE ESL website.

Important Dates

  • Submission deadline: 20 August 2023
  • Notification to authors: 10 October 2023

If you have any queries concerning this special issue, please email the Guest Editors:

Download CFP

Call for Special Issue Proposals

IEEE Embedded Systems Letters (ESL) is inviting proposals for special issues in the broad domain of embedded systems and software, cyber-physical systems, and the Internet of Things. Special issue proposals can focus on any research area that is consistent with the scope of ESL. The idea of the special issue is to provide an opportunity to capture a snapshot of the state-of-the-art on a specific theme, share new perspective, or enable a new research direction.

The prospective guest editor(s) should submit a short written proposal of up to four pages including the following information:

  • Title of the Special Issue
  • The Guest editor(s) name and affiliation
  • The motivation and importance of the theme in the context of ESL
  • The scope of the topics for the special issue
  • Proposed schedule
  • Potential contributors (IEEE rules disallow paper submissions to special issues by authors who have conflict-of-interest with the guest editors)
  • Short bio of the guest editor(s)
  • A draft one-page call for papers for the special issue

Proposals will be competitively selected through a rigorous review process in response to this public Call for Proposals. The selection of the proposals will be made by the Editor-in-Chief in consultation with the editorial board of the journal. Each submitted proposal will be evaluated based on the following criteria:

  • Timeliness, relevance, and coherence of the theme
  • Originality of the theme compared to recent special issues in ESL and other related journals
  • Credential of the prospective Guest Editor(s)

There is no specific deadline for the submission of special issue proposals. Each proposal will be evaluated as and when it is submitted.

Current Call for perspective papers

IEEE Embedded Systems Letters (ESL) is inviting perspective papers in the broad domain of embedded systems and software, cyber-physical systems, and the Internet of Things. A perspective paper could present a grand challenge problem in the field that needs to be addressed, charter a new direction of research, express a contradictory viewpoint, or promote an interdisciplinary research area. The journal hopes that the perspective papers will be of lasting value to the community, and of the highest quality.

The perspective papers will go through the same rigorous peer-review process as the regular papers. However, the prospective authors may choose to first submit (at most) one-page title and abstract to the ESL Deputy Editor-in-Chief Aviral Shrivastava at [email protected] for quick feedback on the suitability of the proposal as a perspective paper. Given a positive assessment, the author may then proceed to expound upon the topic and submit the full perspective paper to

Note that the first step is not mandatory and is only meant to guide the authors. A positive assessment of the abstract does not imply acceptance of the paper. The full perspective paper will be evaluated by an Associate Editor of the journal and selected peer reviewers just like regular papers.

There is no specific deadline for the submission of perspective papers. Each paper will be evaluated as and when it is submitted.



Special Issue Proposals can be submitted to Editor-in-Chief, Preeti Ranjan Panda

ESL Editor-in-Chief

Preeti Ranjan Panda

Indian Institute of Technology, Delhi
10 (Asia and Pacific)

Deputy EiC

Aviral Shrivastava

Arizona State University
United States
6 (Western U.S.)