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Design&Test Associate Editor-in-Chief
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Design&Test Cover Design
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Technical Areas: Keynotes
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Interconnect
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Sudeep Pasricha
Colorado State University
United States
5 (Southwestern U.S.)
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Hiroki Matsutani
Keio University
Japan
Reliability
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Real-Time & Mixed Critically
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Security & Trust
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Kanad Basu
UT Dallas
5 (Southwestern U.S.)
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Fareena Saqib
University of North Carolina at Charlotte
United States
Self-Aware & Adaptive Systems
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Test & Verification Techniques
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Rubin A Parekhji
Texas Instruments
India
Analog, Asynchronous & Mixed Signal
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Low Power Systems
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Somnath Paul
Intel
United States
Deep-Submicron Design, DFM & Yield
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Embedded Software
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Memories
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Multicores
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Umit Ogras
Arizona State University
United States
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Hemangee Kapoor
IITG
India
SoC & 3D
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Lorena Anghel
University Grenoble-Alps
France
Things & Systems of Systems
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Emerging Technologies & Devices
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Yiran Chen
Professor in the Department of Electrical and Computer Engineering
Duke University
United States
3 (Southeastern U.S.)
Physical Design
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ML for EDA
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Jana Doppa
Washington State University
United States
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Mohammad Shafique
NYU, Abu Dhabi
United Arab Emirates
Quantum Computing
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Departments: Interviews
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Currents Editor-in-Chief
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DATC Newsletter
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TTTC Newsletter
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Stefano Di Carlo
Politecnico di Torino
Italy
Latin America Liaison
Perspectives
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Roundtables
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Tutorials
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Publicity
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Ganapati Bhat
Washington State University
United States
Reports
The Road Ahead
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Mike Kishinevsky
Intel
United States
D&T Steering Committee
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Krishnendu Chakrabarty
Duke University
United States
3 (Southeastern U.S.)
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Bruce Hecht
VG2PLAY
United States
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IEEE Production Staff: Senior Director, Publishing Operations
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Director, Editorial Services
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Senior Managing Editor
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Assoc. Dir., Editorial Services
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Director, Production Services
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