Design&Test Editorial Board

Position(s):

Design&Test Editor-in-Chief

Personnel:

Jörg Henkel

EiC, Design&Test
Karlsruhe Institute of Technology (KIT)
Germany
8 (Africa, Europe, Middle East)

Design&Test Associate Editor-in-Chief

Personnel:

Partha Pratim Pande

Washington State University
United States
6 (Western U.S.)

Design&Test Cover Design

D&T TECHNICAL AREAS

Keynotes

Personnel:

Xiaobo Sharon Hu

University of Southampton
United Kingdom
4 (Central U.S.)
Personnel:

Patrick Groeneveld

Synopsys, Inc.
United States
6 (Western U.S.)
Personnel:

Sri Parameswaran

The University of New South Wales
Australia
10 (Asia and Pacific)

Interconnect

Personnel:

Partha Pratim Pande

Washington State University
United States
6 (Western U.S.)
Personnel:

Umit Ogras

Arizona State University
United States
6 (Western U.S.)
Personnel:

Sudeep Pasricha

Colorado State University
United States
5 (Southwestern U.S.)

Reliability

Personnel:

Sanghamitra Roy

Utah State University
United States
6 (Western U.S.)

Real-Time & Mixed Critically

Personnel:

Jian-Jia Chen

8 (Africa, Europe, Middle East)

Security & Trust

Personnel:

Ramesh Karri

New York University
United States
1 (Northeastern U.S.)

Test & Verification Techniques

Personnel:

Vivek Chickermane

Cadence Design Systems
United States
5 (Southwestern U.S.)
Personnel:

Fei Su

Intel Corp.
United States
6 (Western U.S.)
Personnel:

John Carulli

GlobalFoundries
United States
6 (Western U.S.)
Personnel:

Sandeep Kumar Goel

Taiwan Semiconductor Manufacturing Company
Taiwan
10 (Asia and Pacific)
Personnel:

Xin Li

Deputy EiC, IEEE TCAD
Duke University
United States
3 (Southeastern U.S.)
Personnel:

Shreyas Sen

Purdue University
United States
4 (Central U.S.)

Analog, Asynchronous & Mixed Signal

Personnel:

Haralampos Stratigopoulos

Sorbonne Universités, CNRS
France
8 (Africa, Europe, Middle East)

Low Power Systems

Personnel:

Anand Raghunathan

Purdue University
United States
4 (Central U.S.)

Self-Aware & Adaptive Systems

Personnel:

Axel Jantsch

Vienna University of Technology
Austria
6 (Western U.S.)
Personnel:

Laura Pozzi

University of Lugano
Switzerland
8 (Africa, Europe, Middle East)

Deep-Submicron Design, DFM & Yield

Personnel:

Vivek De

Intel Corp.
United States
6 (Western U.S.)

Memories

Personnel:

Said Hamdioui

Delft University of Technology
Netherlands
8 (Africa, Europe, Middle East)
Personnel:

Binoy Ravindran

Virginia Polytechnic Institute & State University
United States
2 (Eastern U.S.)

Embedded Software

Personnel:

Petru Eles

Linköping University
Sweden
8 (Africa, Europe, Middle East)

Multicores

Personnel:

Tulika Mitra

VP Awards
Stanford University
United States
10 (Asia and Pacific)
Personnel:

Chia-Lin Yang

National Taiwan University
Taiwan
10 (Asia and Pacific)

SoC & 3D

Personnel:

Sung Kyu Lim

Georgia Institute of Technology
United States
3 (Southeastern U.S.)
Personnel:

Jin-Fu Li

University of the Chinese Academy of Sciences
China
10 (Asia and Pacific)
Personnel:

Nicola Nicolici

McMaster University
Canada
7 (Canada)
Personnel:

Cecilia Metra

University of Bologna
Italy
8 (Africa, Europe, Middle East)

Things & Systems of Systems

Personnel:

Tei-Wei Kuo

National Taiwan University
Taiwan
10 (Asia and Pacific)
Personnel:

Paul Bogdan

University of Southern California
United States
6 (Western U.S.)
Personnel:

Mohammad Al Faruque

University of California, Irvine
United States
6 (Western U.S.)

Emerging Technologies & Devices

Personnel:

Mircea Stan

University of Virginia
United States
3 (Southeastern U.S.)
Personnel:

Yiran Chen

Duke University
10 (Asia and Pacific)

Physical Design

Personnel:

David Pan

Falcon Computing Solutions, Inc.
United States
5 (Southwestern U.S.)

D&T DEPARTMENTS

Interviews

Personnel:

Yao-Wen Chang

10 (Asia and Pacific)
Personnel:

Magdy Abadir

Helic Inc.
United States
6 (Western U.S.)

Newsletters

Personnel:

Vasilis Pavlidis

VP Publicity
University of Manchester
United Kingdom
8 (Africa, Europe, Middle East)
Personnel:

Theo Theocharides

University of Cyprus
Cyprus
10 (Asia and Pacific)
Personnel:

Joe Damore

IBM (retired)
United States
1 (Northeastern U.S.)

Reports

Personnel:

Yervant Zorian

Test Technology TC (TTTC)
Synopsys, Inc.
United States
10 (Asia and Pacific)
Personnel:

Massimo Poncino

Politecnico di Torino
Italy
8 (Africa, Europe, Middle East)

Perspectives

Personnel:

David Atienza

Immediate Past President
École Polytechnique Fédérale de Lausanne
Switzerland
8 (Africa, Europe, Middle East)
Personnel:

Sri Parameswaran

The University of New South Wales
Australia
10 (Asia and Pacific)
Personnel:

Ahmed Jerraya

Laboratoire d'électronique des technologies de l'information (CEA-Leti)
France
8 (Africa, Europe, Middle East)
Personnel:

Hidetoshi Onodera

Kyoto University
Japan
10 (Asia and Pacific)

Publicity

Personnel:

Mohammad Al Faruque

University of California, Irvine
United States
6 (Western U.S.)

Reviews

Personnel:

Scott Davidson

Oracle
United States
6 (Western U.S.)

Roundtables

Personnel:

David Yeh

Semiconductor Research Corporation
United States
Personnel:

Rajesh K. Gupta

EiC, TCAD
University of California, San Diego
United States
6 (Western U.S.)

The Last Byte

Personnel:

Scott Davidson

Oracle
United States
6 (Western U.S.)

The Road Ahead

Personnel:

Andrew Kahng

University of California, San Diego
United States
6 (Western U.S.)

Tutorials

Personnel:

Swarup Bhunia

University of Florida
United States
Personnel:

Jürgen Teich

Friedrich-Alexander-Universität Erlangen-Nürnberg
Germany
8 (Africa, Europe, Middle East)

Latin America Liaison

Personnel:

Ricardo Reis

Circuits & Systems Representative
Universidade Federal do Rio Grande do Sul
Brazil
9 (Latin America)

D&T Steering Committee

Personnel:

L. Miguel Silveira

VP Publications
IST Técnico Lisboa
Portugal
8 (Africa, Europe, Middle East)
Personnel:

Krishnendu Chakrabarty

Duke University
United States
3 (Southeastern U.S.)
Personnel:

Bruce Hecht

Analog Devices
United States
Personnel:

Enrico Macii

VP for Strategy
Politecnico di Torino
Italy
8 (Africa, Europe, Middle East)
Personnel:

Yervant Zorian

Test Technology TC (TTTC)
Synopsys, Inc.
United States
10 (Asia and Pacific)

Design&Test is a co-sponsored publication of IEEE CEDA, SSCS, and CASS.