TCAD Editorial Board

TCAD Editorial Board

Rajesh K. Gupta

EiC, TCAD University of California, San Diego
IEEE Region: 6




Xin Li

Deputy EiC, IEEE TCAD Duke University

Sara Dailey

Managing Editor, IEEE TCAD IEEE CEDA

Ing-Chao Lin

IEEE TCAD Webmaster National Cheng Kung University

Associate Editors

Analog, Mixed-Signal, and RF Circuits

Fabrizio Bonani

Politecnico di Torino, Dipartimento di Elettronica e Telecomunicazioni 

Saraju P. Mohanty

The University of North Texas, Dept. of Computer Science & Engineering

Xuan Zeng

Fudan University, Shanghai School of Microelectronics

3D  Design & Optimization

Cheng Zhuo

Zhejiang University, Information Science & Electronic Engineering

Design Automation for Cyber-Physical Systems & Internet of Things

Meng-Fan (Marvin) Chang

National Tsing Hua Univ., Dept. of Elect. Eng.

Sudeep Pasricha

CEDA Web/Social Media Activities Manager Colorado State Univ.

Shiyan Hu

TC on Cyber-Physical Systems Michigan Tech. Univ., Dept. of Elect. & Comp. Eng.

Sherif Reda

Brown University

Yongpan Liu

Tsinghua University, Electronics Engineering Dept.

Yiyu Shi

University of Notre Dame, Dept. of Computer Science & Engineering

Qi Zhu

Northwestern University, Electrical Engineering & Computer Science

Embedded Security

Rajat Subhra Chakraborty

Indian Inst. of Tech. Kharagpur, Dept. of Comp. Sci. & Eng.

Ramesh Karri

New York Univ., Tandon School of Eng., Polytechnic Inst.

Chip-Hong Chang

Nanyang Tech. Univ., School of Electrical & Electronic Eng.

Yiorgos Makris

Univ. of Texas at Dallas, Elect. & Comp. Eng.

Yier Jin

Univ. of Florida, Elect. & Comp. Eng.

Qiang Xu

The Chinese Univ. of Hong Kong, Dept. of Comp. Sci. & Eng.

Chengmo Yang

Univ. of Delaware, Elect. & Comp. Eng.

Embedded Systems

Madhu Mutyam

Indian Inst. of Tech. Madras, Dept. of Comp. Sci. & Eng.

Chia-Lin Yang

National Taiwan Univ., Dept. of Comp. Sci. & Info. Eng.

Jiang Xu

Hong Kong Univ. of Sci. & Tech., ECE Dept.

Embedded Software

Preeti Ranjan Panda

Indian Inst. of Tech. Delhi, Dept. of Comp. Sci. & Eng.

Jörg Henkel

EiC, Design&Test Karlsruhe Institute of Technology (KIT)

Sri Parameswaran

EiC, Embedded Systems Letters The University of New South Wales

Zili Shao

The Hong Kong Polytechnic Univ., Dept. of Computing

Emerging Technologies and Applications

Robert Wille

Johannes Kepler Univ., Linz Inst. for Integrated Circuits

FPGAs and Reconfigurable Computing

William Hung

Synopsys Inc.

Philip Leong

The Univ. of Sydney, School of Elect. and Inf. Eng.

Wei Zhang

Hong Kong University of Sci. & Tech., Dept. of Elect. & Comp. Eng.

Human Factors in Design

Jaeha Kim

Seoul National University, Elect. & Comp. Eng.

Aviral Shrivastava

Arizona State University, School of Comp., Informatics, & Decisions Sys. Eng.

Modeling and Simulation

Wenjian Yu

Tsinghua Univ., Dept. of Comp. Sci. & Tech.

Ngai Wong

The University of Hong Kong

Physical Design

Laleh Behjat

University of Calgary, Dept. of Elect. & Computer Eng.

Stephan Held

Univ. of Bonn, Research Inst. for Discrete Mathematics

Iris Hui-Ru Jiang

Design Automation TC National Chiao Tung Univ.

David Pan

Electron Devices University of Texas at Austin

Synthesis and Verification

Shih-Chieh Chang

National Tsing-Hua Univ., Dept. of Computer Sci.

Jordi Cortadella

Universitat Politècnica de Catalunya, Dept. of Software

Rolf Drechsler

Univ. of Bremen/DFKI, Inst. of Computer Sci.

Sicun Gao

University of California, San Diego, Comp. Sci. & Eng.

System-Level Design

Luca Benini

Integrated Systems Laboratory, Dept. of IT & EE

Soontae Kim

Korea Adv. Inst. of Sci. & Tech., Dept. of Computer Sci.

Luca Carloni

Columbia University, Dept. of Computer Science

Hai (Helen) Li

Univ. of Pittsburgh, Dept. of Elect. & Computer Eng.

Ayse Coskun

DAC Representative Boston University, MA

Yu Wang

Tsinghua Univ., Dept. of Electron. Eng.