TCAD Editorial Board Rajesh K. Gupta EiC, TCAD University of California, San Diego IEEE Region: 6 Email 858.822.4391 Website Xin Li Deputy EiC, IEEE TCAD Duke University Sara Dailey Managing Editor, IEEE TCAD IEEE CEDA Ing-Chao Lin IEEE TCAD Webmaster National Cheng Kung University Associate Editors Analog, Mixed-Signal, and RF Circuits Fabrizio Bonani Politecnico di Torino, Dipartimento di Elettronica e Telecomunicazioni Saraju P. Mohanty The University of North Texas, Dept. of Computer Science & Engineering Xuan Zeng Fudan University, Shanghai School of Microelectronics 3D Design & Optimization Cheng Zhuo Zhejiang University, Information Science & Electronic Engineering Design Automation for Cyber-Physical Systems & Internet of Things Meng-Fan (Marvin) Chang National Tsing Hua Univ., Dept. of Elect. Eng. Sudeep Pasricha CEDA Web/Social Media Activities Manager Colorado State Univ. Shiyan Hu TC on Cyber-Physical Systems Michigan Tech. Univ., Dept. of Elect. & Comp. Eng. Sherif Reda Brown University Yongpan Liu Tsinghua University, Electronics Engineering Dept. Yiyu Shi University of Notre Dame, Dept. of Computer Science & Engineering Qi Zhu Northwestern University, Electrical Engineering & Computer Science Embedded Security Rajat Subhra Chakraborty Indian Inst. of Tech. Kharagpur, Dept. of Comp. Sci. & Eng. Ramesh Karri New York Univ., Tandon School of Eng., Polytechnic Inst. Chip-Hong Chang Nanyang Tech. Univ., School of Electrical & Electronic Eng. Yiorgos Makris Univ. of Texas at Dallas, Elect. & Comp. Eng. Yier Jin Univ. of Florida, Elect. & Comp. Eng. Qiang Xu The Chinese Univ. of Hong Kong, Dept. of Comp. Sci. & Eng. Chengmo Yang Univ. of Delaware, Elect. & Comp. Eng. Embedded Systems Madhu Mutyam Indian Inst. of Tech. Madras, Dept. of Comp. Sci. & Eng. Chia-Lin Yang National Taiwan Univ., Dept. of Comp. Sci. & Info. Eng. Jiang Xu Hong Kong Univ. of Sci. & Tech., ECE Dept. Embedded Software Preeti Ranjan Panda Indian Inst. of Tech. Delhi, Dept. of Comp. Sci. & Eng. Jörg Henkel EiC, Design&Test Karlsruhe Institute of Technology (KIT) Sri Parameswaran EiC, Embedded Systems Letters The University of New South Wales Zili Shao The Hong Kong Polytechnic Univ., Dept. of Computing Emerging Technologies and Applications Robert Wille Johannes Kepler Univ., Linz Inst. for Integrated Circuits FPGAs and Reconfigurable Computing William Hung Synopsys Inc. Philip Leong The Univ. of Sydney, School of Elect. and Inf. Eng. Wei Zhang Hong Kong University of Sci. & Tech., Dept. of Elect. & Comp. Eng. Human Factors in Design Jaeha Kim Seoul National University, Elect. & Comp. Eng. Aviral Shrivastava Arizona State University, School of Comp., Informatics, & Decisions Sys. Eng. Modeling and Simulation Wenjian Yu Tsinghua Univ., Dept. of Comp. Sci. & Tech. Ngai Wong The University of Hong Kong Physical Design Laleh Behjat University of Calgary, Dept. of Elect. & Computer Eng. Stephan Held Univ. of Bonn, Research Inst. for Discrete Mathematics Iris Hui-Ru Jiang Design Automation TC National Chiao Tung Univ. David Pan Electron Devices University of Texas at Austin Synthesis and Verification Shih-Chieh Chang National Tsing-Hua Univ., Dept. of Computer Sci. Jordi Cortadella Universitat Politècnica de Catalunya, Dept. of Software Rolf Drechsler Univ. of Bremen/DFKI, Inst. of Computer Sci. Sicun Gao University of California, San Diego, Comp. Sci. & Eng. System-Level Design Luca Benini Integrated Systems Laboratory, Dept. of IT & EE Soontae Kim Korea Adv. Inst. of Sci. & Tech., Dept. of Computer Sci. Luca Carloni Columbia University, Dept. of Computer Science Hai (Helen) Li Univ. of Pittsburgh, Dept. of Elect. & Computer Eng. Ayse Coskun DAC Representative Boston University, MA Yu Wang Tsinghua Univ., Dept. of Electron. Eng.