The past few decades have witnessed rapid advances in sophisticated circuits, algorithms, and systems to tackle many difficult problems and the hardware/software platforms to realize these solutions in physical form. Many of these solutions have been in the form of portable, embedded, or wearable devices and systems while others have been distributed, decentralized, and massively networked as the backbone of cloud computing. A system on Chip (SoC) technology embodies and symbolizes many of these advances. An SoC system comprises several cooperating, interacting, potentially heterogeneous hardware/firmware/software sub-systems. AI (Artificial Intelligence) chips are not only built but also the design and manufacture leverage AI. Several countries including India are on the cusp of a global semiconductor revolution.

The objective of the 2023 International Conference on Intelligent Systems and Embedded Design (ISED-2023) is to provide a serious but enjoyable platform for experts from academia and industry to interact with young researchers in Computing, Electronics, and Communication Engineering as the domain takes center stage in a large swathe of interdisciplinary disciplines. The former (expanded) name of ISED is International Symposium on Embedded Computing and System Design.

Developments in these domains will have a significant impact on the future electronic system design and advanced technologies focusing on being user-friendly, eco-sensitive, smart, and energy efficient. The conference would enable fruitful discussions between experts and other delegates leading to concrete contributions towards advancing the state of the art. We are binging ISED to the Himalayan Regions to spur wide interest in semiconductor systems.

Original, unpublished research papers are solicited from industrial and academic researchers. ISED strives to spur and share, examine and accelerate innovations and studies in a range of related areas, including but not limited to the following conference tracks.